Keynote Speakers:
Professor Alan Willner, University of Southern California, USA
Professor Martin Green, The University of New South Wales, Australia
    Topic: "Future of Solar Energy"
Professor Wen Liu, FiberHome FuHua Electric Co. Ltd., China
    Topic: "Innovative and Cost Effective Optical Components for Fiber Communications"

Tutorial Speakers:
Benjamin J. Eggleton, University of Sydney, Australia
Wing C. Kwong, Hofstra University, USA
    Topic: "Optical Coding Theory"
El-Hang Lee, OPERA/ Inha University, Korea
John D. Love, Australian National University, Australia
Takashi Mizuochi, Mitsubishi Electric Corporation, Japan
    Topic: "Forward Error Correction in Optical Communication Systems"
Andre Richter, VPIsystems, Germany
    Topic: "Photonics Modeling of Components, Systems and Networks"
Jianping Yao, University of Ottawa, Canada
    Topic: "Microwave Photonics"

Invited Speakers:
Sano Akihide, NTT, Japan
Ivan Andonovic, University of Strathclye, UK
Solomon Assefa, IBM, USA
X. Y. Bao, Ottawa, Canada
Tim A. Birks, University of Bath, UK
Dirk van den Borne, Nokia Siemens Networks GmbH & Co., Germany
John E. Bowers, University of California at Santa Barbara, USA
J.-X. Cai, Tyco Telecommunications, USA
Vincent W. S. Chan, Massachusetts Institute of Technology, USA
Peng Chen, Hong Kong University of Science and Technology, Hong Kong
R. T. Chen, The University of Texas, Austin, USA
Shean Jen Chen, National Cheng Kung University, Taiwan
Teehiang Cheng, Nanyang Technological University, Singapore
Sai-Tak Chu, Infinera, USA
Izzat Darwazeh, University College of London, UK
Steve Denbaars, University of California at Santa Barbara, USA
H. J. S. Dorren, Eindhoven University of Technology, The Netherlands
Wolfgang Ecke, IPHT, Germany
Mable P. Fok, Princeton University, USA
Michael Q. Gao, The Australian National University, Australia
Alain Giraud, Nextrom Oy, Finland
K. Gratten, City University , UK
Felix Gwo, National Tsinghua University, Taiwan
Hans Christian Hansen Mulvad, DTU Fotonik, Denmark
Kerry Hinton, University of Melbourne, Australia
Werner Hofmann, University of California at Berkeley , USA
K. Hotate, University of Toyko, Japan
Thomas Hsiang, University of Rochester, USA
Wei Huang, Institute of Advanced Materials, China
Yuefeng Ji, Beijing University of Posts and Telecommunications (BUPT),
  China
Yaohui Jin, Shanghai Jiaotong University, China
Raman Kashyap, Polytechnique Montreal, Canada
Nobuaki Kataoka, NICT, Japan
Tetsuya Kawanishi, NICT, Japan
Nobuhiko Kikuchi, Hitachi Ltd., Japan
Hoon Kim, National University of Singapore, Singapore
K. Kishida, Neubrex Co. Ltd, Japan
Fumio Koyama, Tokyo Institute of Technology, Japan
Bartlomiej Kozicki, NTT Lab, Japan
Cedric F Lam, Google Inc., USA
Kei-May Lau, The Hong Kong University of Science & Technology, China
Elfed Lewis, University of Limerick, Ireland
Feng-Qi Liu, Chinese Academy of Science, China
Yuhwa Lo, University of California at San Diego, USA
Qihong Lou, Shanghai Institute of Optics and Fine Mechanics, China
Eliezer Manor, Specrys Ltd., Israel
Antonio Marti, Uni. Politecnica de Madrid, Spain
Rainer Michalzik, Ulm University, Germany
Idelfonso Tafur Monroy, DTU Fotonik, Denmark
Toshio Morioka, NTT Network Innovation Labs., Japan
Itsuro Morita, KDDI R&D Laboratories, Japan
Shu Namiki, AIST, Japan
Kimio Oguchi, Seikei University, Japan
K. H. Oh, Yonsei University, Korea
Yasutake Ohishi, Toyota Technical Institute, Japan
Mark Pelusi, University of Sydney, Australia
Takahide Sakamoto, NICT, Japan
D. Sampson, UWA, Australia
Ted Schmidt, Opnext Inc, USA
Kwang-Yong Song, Chung-Ang University, Seoul, Korea
Leo Spiekman, Alphion Corporation, USA
Yikai Su, Shanghai Jiao Tong University, China
Maurice O' Sullivan, Nortel, Canada
Chi Kuang Sun, National Taiwan University, Taiwan
Dingyuan Tang, Nanyang Technological University, Singapore
Ralph Tatam, Cranfield University, Cranfield, Bedford, UK
Amirhossein Tehranchi, Ecole Polytechnique, University of Montreal, Montreal, Canada
Jos van der Tol, Technical University of Eindhoven, The Netherlands
Michael J Wale, Active Products Research, UK
Ching Yue Wang, Tianjin University, China
Xu Wang, Heriot-Watt University, UK
K. A. Williams, Eindhoven University of Technology, The Netherlands
Enboa Wu, ASTRI, Hong Kong
H. Xiao, Missouri University of Science & Technology, USA
Chris Xu , Cornell University, USA
Jian Xu, Engineering Science, Pennsylvania State University, USA
Koji Yamada, NTT, Japan
Shinji Yamashita, University of Tokyo, Japan
Tsutomu Yamate, Shulumberger KK, Japan
Chih Chung Yang, National Taiwan University, Taiwan
Xiaoke Yi, University of Sydney, Australia
Ty Yoon, Basas Microsystems, USA
Jianjun Yu, NEC Labs America, USA
Jian Zhao, University College Cork, Ireland
Xiang Zhou, AT&T, USA
Moshe Zukerman, City University of Hong Kong, Hong Kong